A high-speed XYZ manipulator was designed and built to print glue lines for semiconductor die bonding.

High-speed XYZ Glue unit - NXP ITEC

A new technology in the semiconductor industry is to glue IC components to lead frames. To apply the glue accurately a high precision XYZ manipulator is needed. A new concept is developed with the aid of predictive modeling. MI-Partners has manufactured, assembled and tested the first OEM modules.

A new technology in the semiconductor industry is to glue IC components to lead frames. To apply the glue accurately a high precision XYZ manipulator is needed. A new concept is developed with the aid of predictive modeling. MI-Partners has manufactured, assembled and tested the first OEM modules.

High-speed XYZ Glue unit - NXP ITEC
High-speed XYZ Glue unit - NXP ITEC

Challenges

High-speed X Y Z positioning module with high accuracy
Proto phase skipped by means of predictive modeling. The first module is the first of the production series with all the robustness and lifetime requirements

Key Competences

  • Predictive modeling (mode shapes in control loop)
  • Concept design

 

 

High-speed XYZ Glue unit - NXP ITEC

Results

  • A High-speed XYZ Glue unit with:
  • working area of 8 x 8 x 8 mm3
  • accuracy of 5 µm
  • accelerations of 50 m/s2
  • controller implemented on NXP’s FlexDMC drive

Cooperation

  • NXP ITEC (Specifications and reviews)
  • Renishaw/Lasertec (development xy-sensor)
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